Zaidan, Ayad AwadSalman, Ameer HayderAlaiwi, YaserJasim, Jasim Ahmed2024-07-182024-07-182024Zaidan, A. A., Salman, A. H., Alaiwi, Y., Jasim, J. A. (2024). Numerical analysis for a computer immersion-cooling system. International Journal of Heat and Technology, 42(3), 1029-1036. 10.18280/ijht.4203300392-8764https://hdl.handle.net/20.500.12939/4755This study presents a unique forced flow and heat sink cooling system and technique for a single-phase immersed cooling system. Computer systems can use electricity more effectively if electronics cooling systems are done more appropriately. Computers and other electronic devices could be cooled via immersion cooling by immersing them in a thermally conductive liquid or coolant. The CPU surface is covered with a straight -fin heat sink, and the mainboard is immersed in NOVESC 3M 649, a designed fluid that can disperse heat while utilizing immersed cooling. The simulation software program results show that increasing the number of fins from 5 to 9 led to an increase in temperature, velocity, and pressure. However, the highest dissipated power was obtained when using eight fins; therefore, increasing the number of fins is considered ineffective due to the increasing temperature.eninfo:eu-repo/semantics/closedAccessCOMSULImmersion-cooling systemComputerHeat sinkHeat transferArticle423102910362-s2.0-85197443719Q3WOS:001260815200030N/A