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Yazar "Salman, Ameer Hayder" seçeneğine göre listele

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    Efficiency analysis of a two-stage evaporative cooling system with sustainable water pad
    (International Information and Engineering Technology Association, 2024) Salman, Ameer Hayder; Jasim, Jasim Ahmed; Alwan Aljuboori, Mohammed Khudhair; Zaidan, Ayad Awad
    The efficiency of evaporative media typically ranges from 80% to 90%. The most effective systems can reduce the temperature of dry air to 95% of the wet-bulb temperature, while the least effective systems can only accomplish 50%. The rate of evaporation efficiency experiences little decline over time. The climate in Iraq has a more extended period of summer in comparison to other nations. The ambient temperature during this season exceeds 50oC, making the evaporative cooling system appropriate for this region. The evaporative cooler in this study is created by incorporating multiple heat exchanger stages (water-air) to cool the input air indirectly and indirectly before cooling directly inside the traditional evaporative cooler. When compared to compression refrigeration systems, the multistage evaporative cooler helps to reduce energy use, environmental pollution, the effects of global warming, and manufacturing costs. The multistage evaporative cooler is appropriate for use in homes and sizable structures with high relative humidity and temperatures. The developed evaporative cooler's experimental findings demonstrated that the addition of a cooling stage to a conventional cooler reduces the out-dry bulb temperature by about 50% and the specific humidity by about 80%.
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    Öğe
    Numerical analysis for a computer immersion-cooling system
    (2024) Zaidan, Ayad Awad; Salman, Ameer Hayder; Alaiwi, Yaser; Jasim, Jasim Ahmed
    This study presents a unique forced flow and heat sink cooling system and technique for a single-phase immersed cooling system. Computer systems can use electricity more effectively if electronics cooling systems are done more appropriately. Computers and other electronic devices could be cooled via immersion cooling by immersing them in a thermally conductive liquid or coolant. The CPU surface is covered with a straight -fin heat sink, and the mainboard is immersed in NOVESC 3M 649, a designed fluid that can disperse heat while utilizing immersed cooling. The simulation software program results show that increasing the number of fins from 5 to 9 led to an increase in temperature, velocity, and pressure. However, the highest dissipated power was obtained when using eight fins; therefore, increasing the number of fins is considered ineffective due to the increasing temperature.

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