Effects of Ag content on microstructure evolution, intermetallic compound (IMC) and mechanical behaviour of SAC solder joints

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dc.contributor.authorSabbar, Ehsan H.
dc.contributor.authorAl-Zubaidi, Hazim A.
dc.contributor.authorAljumaili, Amer K.
dc.contributor.authorAl-Jumaili, Mustafa H.
dc.contributor.authorAl-Jumaili, Ahmed I.
dc.contributor.authorAlsheakh, Hussein
dc.date.accessioned2023-09-06T11:45:53Z
dc.date.available2023-09-06T11:45:53Z
dc.date.issued2023en_US
dc.departmentEnstitüler, Lisansüstü Eğitim Enstitüsü, Elektrik ve Bilgisayar Mühendisliği Ana Bilim Dalıen_US
dc.description.abstractSnAgCu (SAC) solder joints are widely used in electronic industry as alternative to lead free solder. The microstructure of the solder joint plays an important role in enhancing the mechanical properties of the solder joint, thus the electronic devices will have a longer lifetime. This paper studies the effects of silver (Ag) per-centage on the microstructure and intermetallic compound (IMC) in Sn-Ag-Cu solder, and how the addition of Ag impacts the mechanical concepts of SAC solder joints. SAC solder joints were examined as a function of Ag3Sn precipitates (in terms of the number and size of the precipitates) and intermetallic compounds (IMCs). The microstructure morphology of the SAC samples was analyzed by using a scanning electron microscope (SEM) with back scattering mode.A quantitative analysis of number of Ag3Sn was performed for all SAC samples. The results showed that when the amount of the Ag content increased, that led to an increase in the number of Ag3Sn precipitates with an increase the eutectic area but does not affect the growth of IMC. The mechanical properties of SAC samples were enhanced significantly by increasing the Ag content.en_US
dc.identifier.citationSabbar, E. H., Al-Zubaidi, H. A., Aljumaili, A. K., Al-Jumaili, M. H., Al-Jumaili, A. I., & Alsheakh, H. (2023). Effects of Ag content on microstructure evolution, intermetallic compound (IMC) and mechanical behaviour of SAC solder joints. Microelectronics Reliability, 147.en_US
dc.identifier.issn0026-2714
dc.identifier.issn1872-941X
dc.identifier.scopus2-s2.0-85167989402
dc.identifier.scopusqualityQ2
dc.identifier.urihttps://hdl.handle.net/20.500.12939/3827
dc.identifier.volume147en_US
dc.identifier.wosWOS:001046873100001
dc.identifier.wosqualityQ3
dc.indekslendigikaynakWeb of Science
dc.indekslendigikaynakScopus
dc.institutionauthorAl-Jumaili, Mustafa H.
dc.language.isoen
dc.relation.ispartofMicroelectronics Reliability
dc.relation.isversionof10.1016/j.microrel.2023.115103en_US
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - İdari Personel ve Öğrencien_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectMicrostructureen_US
dc.subjectIntermetallic compounden_US
dc.subjectSACen_US
dc.subjectAg3Snen_US
dc.subjectShear strengthen_US
dc.titleEffects of Ag content on microstructure evolution, intermetallic compound (IMC) and mechanical behaviour of SAC solder joints
dc.typeArticle

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