Bond durability of contemporary universal adhesives: Effect of dentin treatments and aging
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Tarih
2019
Yazarlar
Dergi Başlığı
Dergi ISSN
Cilt Başlığı
Yayıncı
Taylor & Francis Ltd
Erişim Hakkı
info:eu-repo/semantics/closedAccess
Özet
The aim of this in vitro investigation was to evaluate the effects of different dentin treatments on mu TBS values of three different universal adhesives. Sixty extracted bovine incisors were used. The teeth were horizontally sectioned from the enamel-cement junction and embedded in an acrylic resin. Enamel was removed with 180-grit SiC paper to expose dentin. The exposed dentin surfaces were further polished with 600-grit SiC paper to provide a standardized smear layer. Teeth were randomly divided into three groups, according to the universal adhesives: All-Bond Universal, Single Bond Universal, and G-Bond Plus. Each group was then assigned into four subgroups, according to the dentin treatments: etch-and-rinse mode (ER), ER + 2% chlorhexidine (CHX), ER + %2.5 genipin (GE), and self-etch mode (SE). Samples were longitudinally sectioned across the bonded-interfaces to obtain resin-dentin beams. Beams were prepared from the same teeth were randomly and equally divided into two groups: immediate mu TBS testing and mu TBS testing after 6-month. The failure loads were recorded in MPa, and failure modes were evaluated at 30x magnification. The data were analyzed using a two-way ANOVA, to determine the effects of dentin treatment and storage time, and the interaction of these two factors on the mu TBS of universal adhesives. Dentin treatments were showed significant differences (p<0.05). ER mode exhibited higher mu TBS than SE mode. However, universal adhesives were more durable in the SE mode than ER mode. Also, chlorhexidine treatment significantly improved adhesive performance of all universal adhesives, while no significant improvement was detected with genipin treatment.
Açıklama
Sismanoglu, Soner/0000-0002-1272-5581
Anahtar Kelimeler
Universal Adhesives, Chlorhexidine, Genipin, Durability, Bond Strength
Kaynak
Journal of Adhesion Science and Technology
WoS Q Değeri
Q2
Scopus Q Değeri
Q2
Cilt
33
Sayı
18
